Metrology Microscope

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology, we require a digital microscope to perform measurement and imaging of semiconductor-die, packages at various stages of assembly, modules and populated/unpopulated printed circuit boards (PCBs). The measurement system shall allow the CSA Catapult to perform in-house 3D geometrical measurement th…