Lapping and Polishing Machine

Scope The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds as the system is not for mass production. As a part of the package assembly research and development methodology, we require a lapping and polishing machine to handle a wide range of metals and ceramics (copper, aluminium, titanium, beryllium, molybdenum, alumina, zirconium oxide and fused silica, silic…