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Metrology Microscope

Part of Metrology Microscope.

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The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology, we require a digital microscope to perform measurement and imaging of semiconductor-die, packages at various stages of assembly, modules and populated/unpopulated printed circuit boards (PCBs). T…

Published
12 Nov 2020
Status
active
CPV
31600000 — Electrical equipment and apparatus
Tender period
— – 3 Dec 2020
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What type of notice is this?

This is a tender notice published via Contracts Finder on 12 Nov 2020.

Which procurement does this notice belong to?

It is part of "Metrology Microscope", published by COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED.

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