The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology, we require a digital microscope to perform measurement and imaging of semiconductor-die, packages at various stages of assembly, modules and populated/unpopulated printed circuit boards (PCBs). T…
- Procurement
- Metrology Microscope
- Published
- 12 Nov 2020
- Status
- active
- CPV
- 31600000 — Electrical equipment and apparatus
- Tender period
- — – 3 Dec 2020
Other notices in this procurement
This is the only notice on record.
FAQs about this notice
What type of notice is this?
This is a tender notice published via Contracts Finder on 12 Nov 2020.
Which procurement does this notice belong to?
It is part of "Metrology Microscope", published by COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED.
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