The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards. The bond test system shall allow the CSA Catapult to perform in-house measurements of die bonded (bonding of a ch…
- Procurement
- Bond Tester
- Published
- 9 Jan 2020
- Status
- complete
- CPV
- 31710000 — Electronic equipment
- Tender period
- — – 30 Sept 2019
Awards
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FAQs about this notice
What type of notice is this?
This is a award notice published via Contracts Finder on 9 Jan 2020.
Which procurement does this notice belong to?
It is part of "Bond Tester", published by COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED.
Has this notice resulted in an award?
1 award is recorded on this notice, including to Inseto (UK) Limited.
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