The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards. The bond test system shall allow the CSA Catapult to perform in-house measurements of die bonded (bonding of a ch…
- Procurement
- Bond Tester
- Published
- 17 Sept 2019
- Status
- active
- CPV
- 31710000 — Electronic equipment
- Tender period
- — – 30 Sept 2019
Other notices in this procurement
FAQs about this notice
What type of notice is this?
This is a tender notice published via Contracts Finder on 17 Sept 2019.
Which procurement does this notice belong to?
It is part of "Bond Tester", published by COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED.
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