Find a Tender · Contract
NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.
A public procurement published by University of Strathclyde via Find a Tender.
- —
- Award value
- £1.9m
- Tender value
- 1
- Suppliers
- 1
- Awards
- 3
- Notices
- Contract
- Stage
Overview
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
Key details
- Source
- Find a Tender
- Lifecycle stage
- Contract
- Status
- planned
- CPV classification
- 31712330 — Semiconductors
- Currency
- GBP
- Total award value
- —
- Tender value
- £1,900,000
- First published
- 23 Aug 2023
- Last updated
- 3 Jul 2024
Awards
1 award recorded on this procurement.
Notice timeline
Every published notice in this procurement's lifecycle.
- Planning noticeNMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.
- Tender noticeNMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.
- Award,contractNMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.
All suppliers
Frameworks & programmes
More from University of Strathclyde
FAQs about this procurement
Who is the buyer for "NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment."?
NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment. is a UK public-sector procurement published by University of Strathclyde via Find a Tender.
Has "NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment." been awarded?
Yes — 1 award is recorded, with a reported total value of £1,900,000. The current lifecycle stage is "Contract".
Which suppliers are involved in "NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment."?
1 supplier is linked: Accelonix.
What is "NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment." worth?
The reported tender value is £1,900,000.
When was "NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment." published?
It was first published on 23 Aug 2023 and last updated on 3 Jul 2024, across 3 notices.
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