Tender notice · Contracts Finder
Thermal Imaging IR Camera System
Part of Thermal Imaging IR Camera System.
The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. The facility enables research, proof of concept and provides capability to demonstrate feasibility and undertake small volume prototype builds. As a part of the package assembly research and development methodology, we require an IR thermal imaging system to validate compound semiconductor-based package/module/PCB thermal designs and potentially to test materials.…
- Procurement
- Thermal Imaging IR Camera System
- Published
- 12 Nov 2020
- Status
- active
- CPV
- 31600000 — Electrical equipment and apparatus
- Tender period
- — – 27 Nov 2020
Other notices in this procurement
This is the only notice on record.
FAQs about this notice
What type of notice is this?
This is a tender notice published via Contracts Finder on 12 Nov 2020.
Which procurement does this notice belong to?
It is part of "Thermal Imaging IR Camera System", published by COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED.
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