Tender notice · Contracts Finder

Thermal Imaging IR Camera System

Part of Thermal Imaging IR Camera System.

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The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. The facility enables research, proof of concept and provides capability to demonstrate feasibility and undertake small volume prototype builds. As a part of the package assembly research and development methodology, we require an IR thermal imaging system to validate compound semiconductor-based package/module/PCB thermal designs and potentially to test materials.…

Published
12 Nov 2020
Status
active
CPV
31600000 — Electrical equipment and apparatus
Tender period
— – 27 Nov 2020
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What type of notice is this?

This is a tender notice published via Contracts Finder on 12 Nov 2020.

Which procurement does this notice belong to?

It is part of "Thermal Imaging IR Camera System", published by COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED.

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