Tender notice · Contracts Finder
Semi-Automatic Wire Bonder
Part of Semi-Automatic Wire Bonder.
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we are looking to increase our capacity with wire bonding. We currently have a Hesse BJ653 with five bondheads to provide the capability to bond in a variety of applications. This includes fine wire…
- Procurement
- Semi-Automatic Wire Bonder
- Published
- 11 Nov 2020
- Status
- active
- CPV
- 31600000 — Electrical equipment and apparatus
- Tender period
- — – 25 Nov 2020
Other notices in this procurement
This is the only notice on record.
FAQs about this notice
What type of notice is this?
This is a tender notice published via Contracts Finder on 11 Nov 2020.
Which procurement does this notice belong to?
It is part of "Semi-Automatic Wire Bonder", published by COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED.
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