Award,contract · Public Contracts Scotland
NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
- Buyer
- Dundee City Council
- Published
- 3 Jul 2024
- Status
- complete
- CPV
- 31712330
- Tender period
- —
Awards
Other notices in this procurement
FAQs about this notice
What type of notice is this?
This is a award,contract published via Public Contracts Scotland on 3 Jul 2024.
Which procurement does this notice belong to?
It is part of "NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.", published by Dundee City Council.
Has this notice resulted in an award?
1 award is recorded on this notice, including to James Breck Ltd.
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