Scope The Compound Semiconductor Applications (CSA) Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow research, proof of concept and demonstrate its feasibility and small volume prototype build. As part of the electronics package assembly research and development methodology we require a machine that can produce customised prototype metal parts using additive manufacturing technology. This will allow the CSA Catapult to support the Drivi…
- Procurement
- Metal 3D Printer
- Published
- 30 Apr 2021
- Status
- active
- CPV
- 38000000 — Laboratory, optical and precision equipments (excl. glasses)
- Tender period
- — – 13 May 2021
Other notices in this procurement
FAQs about this notice
What type of notice is this?
This is a tender notice published via Find a Tender on 30 Apr 2021.
Which procurement does this notice belong to?
It is part of "Metal 3D Printer", published by COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED.
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