Tender notice · Contracts Finder
Automated Multipurpose Wire Bonder
Part of Automated Multipurpose Wire Bonder.
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build. As part of the package assembly research and development methodology we require a machine to perform wire bonding from chips and modules on to substrates and PCB boards. The wire bonding equipment shall allow manual and automated bonding for experimentation and low…
- Procurement
- Automated Multipurpose Wire Bonder
- Published
- 5 Apr 2019
- Status
- active
- CPV
- 38000000 — Laboratory, optical and precision equipments (excl. glasses)
- Tender period
- — – 7 May 2019
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FAQs about this notice
What type of notice is this?
This is a tender notice published via Contracts Finder on 5 Apr 2019.
Which procurement does this notice belong to?
It is part of "Automated Multipurpose Wire Bonder", published by COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED.
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