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Additional 4 Kits & Chipset
Part of Additional 4 Kits & Chipset.
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4 vision/camera units to be built (comprised of 4 of each: CMOS sensor, PCB, DCDC converter and PWM driver ASIC), a CMOS sensors (without PCB and with DCDC converter) and a Serializer (also without PCB and with DCDC converter).
- Procurement
- Additional 4 Kits & Chipset
- Published
- 24 Feb 2026
- Status
- complete
- CPV
- —
- Tender period
- —
Other notices in this procurement
FAQs about this notice
What type of notice is this?
This is a award,contract published via Find a Tender on 24 Feb 2026.
Which procurement does this notice belong to?
It is part of "Additional 4 Kits & Chipset", published by UK Atomic Energy Authority.
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