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662 - Laser Direct Structuring System

Part of 662 - Laser Direct Structuring System.

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Laser Direct Structuring System for Moulded Interconnect Devices. This system is used to create printed copper tracks on 3D surfaces. It consists of a Laser Direct Structuring unit and copper electroless plating system which allows the creation of 3D printed electronic products and systems.

Published
7 Sept 2017
Status
active
CPV
38000000 — Laboratory, optical and precision equipments (excl. glasses)
Tender period
— – 22 Sept 2017
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FAQs about this notice

What type of notice is this?

This is a tender notice published via Contracts Finder on 7 Sept 2017.

Which procurement does this notice belong to?

It is part of "662 - Laser Direct Structuring System", published by Centre for Process Innovation.

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